HDG200-DN-3
HDG200-DN-3
Part number:
HDG200-DN-3-ND
Product_Category
RF Transceiver ICs
Manufacturer
H&D Wireless
Type
IC RF TXRX+MCU
Encapsulation
Package
Tray
RoHS:
NO
Quantity
280
$2.8552
Minimun: 1
multiples: 1
Quantity
Price
Total
1
$2.8552
$2.8552
10
$2.6352
$26.3520
25
$2.4160
$60.4000
80
$2.2328
$178.6240
230
$2.1232
$488.3360
HDG200-DN-3 NEWS
Specifications
PDF1
PDF2
TYPEDESCRIPTION
MfrH&D Wireless
Series-
PackageTray
Product StatusACTIVE
Package / Case44-TQFN Exposed Pad Module
Mounting TypeSurface Mount
Frequency2.4GHz
Memory Size1kB EEPROM, 160kB SRAM
TypeTxRx + MCU
Operating Temperature-40°C ~ 85°C
Voltage - Supply2.75V ~ 3.6V
Power - Output17dBm
Protocol802.11b/g/n
Current - Receiving49mA
Data Rate (Max)72.2Mbps
Current - Transmitting197mA
Supplier Device Package44-QFN SIP (8x8)
RF Family/StandardWiFi
Serial InterfacesSDIO, SPI
DigiKey ProgrammableNot Verified
0755-8253 9284 / 15112891038
sales3@dtc-ic.com,sales2@dtc-ic.com