W66AP6NBQAHJ
W66AP6NBQAHJ
Part number:
256-W66AP6NBQAHJ-ND
Product_Category
Memory
Manufacturer
Winbond Electronics Corporation
Type
1GB LPDDR4, X16
Encapsulation
Package
Tray
RoHS:
YES
Quantity
200
$0.4968
Minimun: 1
multiples: 1
Quantity
Price
Total
1
$0.4968
$0.4968
10
$0.4464
$4.4640
25
$0.4216
$10.5400
80
$0.3656
$29.2480
230
$0.3464
$79.6720
440
$0.3112
$136.9280
945
$0.2624
$247.9680
2400
$0.2496
$599.0400
W66AP6NBQAHJ NEWS
Specifications
PDF1
TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusACTIVE
Package / Case200-TFBGA
Mounting TypeSurface Mount
Memory Size1Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4
Clock Frequency2.133 GHz
Memory FormatDRAM
Supplier Device Package200-TFBGA (10x14.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_11
Access Time3.6 ns
Memory Organization64M x 16
0755-8253 9284 / 15112891038